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New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Effects of Extrusion Process Conditions on "Die Pick-Up".
Effects of Extrusion Process Conditions on Die Pick-Up by Dr. T Pasang
by Dr. T Pasang
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Effects of Extrusion Process Conditions on Die Pick-Up
by Dr. T Pasang
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VDM Verlag. Paperback. New. Paperback. 108 pages. Dimensions: 8.7in. x 5.9in. x 0.3in.In this research AA6060 alloy was used and was extruded at 25mmin, 30mmin, 35mmin, 40mmin and45mmin for a particular profile. The highest exittemperature increased from 542C to 567C when theextrusion speed was increased from 25mmin to 45mmin. Three types of die pick-up were identified. They werenamed as normal pick-up, die line pick-up and lumppick-up. Normal pick-up occurred regardless of theextrusion speed and exit temperature; however theamount of normal pick-up did not increase when theextrusion speed was increased. Die line pick-up occurred when the extrusion speed was 45mmin andappeared only on the die lines. Lump pick-up is notsignificant since it was very rare. AA6060 (0. 4Mg and 0. 5Si) alloy has about 0. 27 excess silicon and therefore at 555C, Mg2Siparticles react with aluminium and excess silicon toform liquid. However normal pick-up and die linepick-up still occurred at temperatures lower andhigher than 555C and therefore it confirms thateutectic reactions do not influence formation of pickup. Therefore die pick-up is most likely to be caused due to a mechanical process ratherthan a metallurgical process. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN.
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- Quantity Available 20
- ISBN 10 3836484315
- ISBN 13 9783836484312
- Publisher VDM Verlag
- Keywords Dr. T Pasang,Robbie Peris,Associate Professor Z. W Chen,Engineering,Physics,Technology,General and Reference,Chemistry
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Effects of Extrusion Process Conditions on "Die Pick-Up"
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Effects of Extrusion Process Conditions on Die Pick-Up
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Effects of Extrusion Process Conditions on Die Pick-Up": Extrusion Temperature and Extrusion Speed
by Dr. T Pasang, Robbie Peris, Associate Professor Z.W Chen
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