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Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging

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Fundamentals of Microsystems Packaging

by Tummala, Rao R

  • New
  • Hardcover
  • first
Condition
New
ISBN 10
0071371699
ISBN 13
9780071371698
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About This Item

New York: McGraw-Hill, 2001. Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Includes full coverage of electrical, mechanical, chemical, and materials aspects of each technology; easy-to-read schematics and block diagrams; fundamental approaches to all system issues; examples of all common configurations and technologies, wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others; details on chip-to-board connections, sealing and encapsulation, and manufacturing processes; basics of electrical and reliability testing. 967 pp. Illustrated.. First Edition. Hard Cover. New. 4to - over 9¾" - 12" tall.

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Details

Bookseller
GlobalAcademics US (US)
Bookseller's Inventory #
EG-43
Title
Fundamentals of Microsystems Packaging
Author
Tummala, Rao R
Format/Binding
Hardcover
Book Condition
New New
Edition
First Edition
ISBN 10
0071371699
ISBN 13
9780071371698
Publisher
McGraw-Hill
Place of Publication
New York
Date Published
2001
Keywords
Engineering, Electronics, Optoelectronics, Mathematics, Physics, Photonics, Microelectronics, Rf, Manufacturing, Industry, Electricity, Chemistry, Wafer Level Packaging, Encapsulation, Chip-to-Board, Schematics, Microvia, Science, Technology
Bookseller catalogs
Engineering;
Size
4to

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