Description:
Wiley & Sons, Incorporated, John, 1989. Hardcover. Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.Dust jacket quality is not guaranteed.
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Microelectronics Packaging Handbook Hardcover - 1988 - 1st Edition
by Tummala; R. R. Tummala; Eugene J. Rymaszewski (Editor)
Details
- Title Microelectronics Packaging Handbook
- Author Tummala; R. R. Tummala; Eugene J. Rymaszewski (Editor)
- Binding Hardcover
- Edition number 1st
- Edition 1
- Pages 1194
- Volumes 1
- Language ENG
- Publisher Van Nostrand Reinhold Company, New York
- Date December 31, 1988
- Illustrated Yes
- ISBN 9780442205782 / 0442205783
- Weight 3.9 lbs (1.77 kg)
- Library of Congress subjects Microelectronic packaging - Handbooks,
- Library of Congress Catalog Number 88014254
- Dewey Decimal Code 621.381
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Microelectronic Packaging Handbook
by Tummala, R.R.
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Microelectronic Packaging Handbook
by Tummala, R.R.
- Used
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- Hardcover
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- ISBN 10 / ISBN 13
- 9780442205782 / 0442205783
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Seattle, Washington, United States
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Description:
Wiley & Sons, Incorporated, John, 1989. Hardcover. Acceptable. Disclaimer:A readable copy. All pages are intact, and the cover is intact. Pages can include considerable notes-in pen or highlighter-but the notes cannot obscure the text. At ThriftBooks, our motto is: Read More, Spend Less.Dust jacket quality is not guaranteed.
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Microelectronics Packaging Handbook
by Tummala, R.R
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Springer, 1988-12-31. Hardcover. Very Good. 9x6x2. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book.
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Microelectronics Packaging Handbook
by Tummala, R.R.
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- 9780442205782 / 0442205783
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Frederick, Maryland, United States
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Springer. Used - Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains. NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES.
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Microelectronics Packaging Handbook
by Tummala, Rao R., and Eugene J. Rymaszewski
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Van Nostrand Reinhold. 1989. Hardcover. UsedVeryGood. Hardcover; light fading, light shelf wear to exterior; otherwise in very go od condition with clean text, firm binding. Dust jacket, light fading, ligh t shelf wear. .
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Microelectronics Packaging Handbook
by Tummala, R.R
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San Diego, California, United States
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Springer, 1988-12-31. Hardcover. New. New. In shrink wrap. Looks like an interesting title!
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Microelectronics Packaging Handbook Tummala, R. R. and Rymaszewski, E.J.
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In overall good condition, no pages missing. Shipping can take between 2-6weeks for international deliveries. Hardback copies may or may not have dust jackets, please get in contact for more information.
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